3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2
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Details
Highlights
- Designed for 250°F (120°C) cure
- Adhesive can be cured from 180°F (80°C) up to 300°F (150°C)
- Excellent shop handling characteristics
- Excellent pre-bond humidity performance on composite substrates
- Unsupported version available for reticulation
- Enables design flexibility; high bond strength from -67°F to 250°F (-55°C to 121°C)
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 encompasses a family of thermosetting modified epoxy adhesives in film form that provides long-term durability and meets specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.
Allows for harmonization.
Specifications
Resources
