Sondhi™ Rapid-Set Indirect Bonding Adhesive allows you to use indirect bonding for more accurate bracket placement, less chair time, and reduced bond failures.
The Sondhi™ Rapid-Set Indirect Bonding Adhesive is revolutionary from every angle. This lightly filled resin is designed to complement our APC™ Adhesive Coated Appliances and cures in half the time (2 minutes vs. 4 minutes) of other indirect adhesives, while achieving two thirds of its bond strength within the first five minutes. Any way you look at it, indirect bonding is superior with the Sondhi Rapid-Set Indirect Bonding Adhesive.