3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarisation (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimises wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk CMP pad conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond CMP pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimise your CMP performance.