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  6. 3M™ CeQUIN 510 Inorganic Insulating Paper Laminate 20 mil(5+10+5)

3M™ CeQUIN 510 Inorganic Insulating Paper Laminate 20 mil(5+10+5)

  • 3M ID 7010409051

Tear-resistant, polyester film offers high mechanical strength

Offers good dielectric stability and high thermal conductivity

Ideal for ground, layer, and interwinding insulation

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Details

Highlights
  • Tear-resistant, polyester film offers high mechanical strength
  • Offers good dielectric stability and high thermal conductivity
  • Ideal for ground, layer, and interwinding insulation
  • Suitable for high-temperature electrical insulation applications rated up to Class 220(R)

3M™ CeQUIN 510 Inorganic Insulating Paper Laminate is a three-ply composite of 3M™ TufQUIN™ Hybrid Insulating Paper bonded to both sides of 3M™ CeQUIN 3000 Inorganic Insulating Paper for use in high-temperature electrical applications up to Class 220®.

3M™ CeQUIN 510 Inorganic Insulating Paper Laminate is a three-ply composite of 3M™ TufQUIN™ Hybrid Insulating Paper bonded to both sides of CeQUIN 3000 Paper for use in high-temperature electrical applications. Qualified for use in electrical insulation systems up to Class 220 ® per UL 1446 and IEC Std. 60085; CSA Component Acceptance at 220°C. Applications include core wrap and barrier insulation in dry-type transformers. The combination of 3M™ TufQUIN Inorganic Hybrid Insulating Paper with CeQUIN paper provides maximum strength and cut-through resistance required to meet rigorous coil winding applications. CeQUIN 510 paper offers the high-performance capabilities of inorganic-based papers including excellent thermal and dielectric stability, high thermal conductivity, long-term voltage endurance, and low moisture absorption. CeQUIN 510 paper is compatible with commonly used impregnating varnishes and resins, and is easily impregnated, further enhancing thermal conductivity and coil bonding characteristics. 3M™ Innovative Paper Technologies UL Recognized Insulation Systems (File No. 65007) may be found on UL’s Electrical Insulation Systems Database at http://www.ul.com/eis/ .

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